Over 30 years of experience
in the design and manufacture of industrial electronics
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Custom Electronic
electronic systems and circuits for every need
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For over 30 years we have been involved in the design and production of electronic boards

With a team of highly qualified engineers and with many years of experience in the field of industrial electronics, we can satisfy every type of request from the customer, both from a hardware and firmware point of view.

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Work on behalf of third parties

As subcontractors we are a reliable and serious partner. Able...

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Custom Project

Do you have an original idea? Contact us to find...

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Our services

Not only design and manufacture of electronic components, we also...

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SVG Layer IOT
Internet of Things

After years of study and research, we have developed an important experience in the field of the Internet of things and we are able to provide the ability to connect objects and create a smart exchange between the things that surround us.

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Applications

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News
Technological investment: the new AXC 800 III component counter
A good warehouse organization is a critical success factor and can be a long-term competitive advantage. For this EL.C.A. has equipped itself with a new component counter that allows better inventory and stock management . Encouraging technological investments and improving business processes, increasing the rate of digitization and innovation, are key points in our company’s […]
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News
The legacy of Brionvega and the origins of EL.C.A.
There are stories that make huge turns and then come back. There are human and professional experiences that leave their mark even after many years. In 1986, once Brinel’s experience was over, some workers from Brionvega di Asolo put on the move started a cooperative specialized in the design and production of electronic boards. Thus […]
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News
The importance of humidity control in electronic components
MSDs moisture sensitive electronic components have a limited life (Floor Life) which corresponds to the maximum acceptable time that elapses between the moment of removal from the Dry-Pack packaging up to the moment of exposure to the temperature of reflow. The IPC / JEDEC J-STD-033B.1 standard defines the standard methods for packaging, storage, shipping and […]
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