Applications of microelectronics

Underestimating soldering applications is the leading cause of circuit and component damage. In any case, it can jeopardize the success of the welding cycle, whether it is production or rework.

In today’s electronic circuits the thermal demand is mainly given by the electrical connections, by the number and thickness of the ground planes, by the presence of heat sinks or other elements that “absorb” heat. To obtain a good joint it is necessary to heat not only the component but also (and above all) the pad and the substrates connected to it. Consequently, it is not easy to judge the thermal demand of an application only visually and micro-weldings are among the most difficult applications to implement, even if they are now in common use.

Without the right equipment, you risk missing your target or even doing damage. For this reason every retouching station in EL.C.A. is equipped with stations that allow you to weld components smaller than 2×1 mm with the highest possible technological precision. These devices offer limited contact surfaces and require extremely small and tapered tips. To ensure optimal thermal transfers, they require excellent thermal transfer technology at the base, capable of delivering a precise temperature where it is needed.

In addition to technological investments, the strength of EL.C.A. resides in its own staff. In 2019, 8 operators achieved the first CIS (Certified IPC Specialist) certification . The “IPC-7711/7721 – Rework, modification and repair of electronic assemblies” course provided them with guidelines for removing and replacing electronic components and for repairing printed circuit boards with minimal impact on quality and reliability.
During 2022, the training of a CIT (Certified IPC Trainer) operator in accordance with the IPC-7711/7721 standard is also planned in order to be able to internally train and specialize additional personnel.