The burn-in test for the reliability of electronic boards

Higher temperatures, such as those that occur in the summer months are a source of stress for products and electronic boards. Excessive heat can cause beaks or fractures in electronic components and their welds. It is possible to predict the occurrence of these failures related to extreme climatic conditions by carrying out, during the production phase, the appropriate burn-in tests. Before commissioning, components of an electrical system are tested for high temperatures.

The burn-in test, also known as HASS (highly accelerated stress screening), provides very useful information on the realiability of an electrical component. It is a break-in artificially stressful conditions. It allows to detect early faults due to temperatures and polarizations higher than normal conditions of use and at particular temperature cycles. This type of test, through thermal shock, tests the strenght of the material. It can highlight faults such as the breakage of welds or pins, highlighting any manufacturing anomalies of the electronic board: surface defects, metallization and welding.

Elca performs burn-in tests aside climate chambers, not only to test the behaviour of electronic boards in situation of thermal stress, but also to trace the infant mortality of electrical components. High temperatures, in fact, also speed up the normal conditions of use of electronic components and allow you to perform an accelerated aging test to find out what are the elements that, in the long therm, can be subject to breakage.